Dow Electronic Materials - Cleaning Up PCB Final Finish: Cyanide-Free ENIG Coatings
29 Aug 2017
Dow Electronic Materials is proud to announce that Dr. Krishna Balantrapu will give a presentation on their exciting new ink jet resist technology at the SUR/FIN 2017 trade show in Atlanta.
29 Aug 2017
Coventry University works with NPL on metallising textiles using A-Gas EM's electroless copper.
29 Aug 2017
The CRUPPAIL project will deliver a new chemical process that can plate zinc-nickel, but match the technical properties of cadmium.
29 Aug 2017
A-Gas EM to be represented at Surface World Live 2017 by Mark Nicholls and Graham Woodward
12 May 2017
Dow discuss the capabilities of Fan-Out Panels Packaging becoming a near reality.
12 May 2017
Benjamin Mogg and Chris Pugh attend the IDTechEx Show in Berlin. Connecting emerging technologies with Global Brands.
12 May 2017
A-Gas EM attended last nights MD's conference awards evening and site visit to Rapid Recovery.
17 Mar 2017
Autonomous Cars are Driving the Next Gen of PCB Material Requirements.
09 Feb 2017
LG Motion – Drives and Control Specialist presents customised positioning system for a leading UK research institute.
01 Dec 2016
Partly funded by Innovate UK, the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding.
18 Nov 2016
A multi-partner UK R&D project that developed a method for de-polluting printed circuit board (PCB) manufacturing waste has won an important environmental award.
10 Nov 2016
Jonathan Sellars (MD of A-gas EM) attended last weeks extraordinary Innovate 2016 event:
10 Nov 2016
Argential, a wholly owned subsidiary of Microchem Corp has announced that effective August 31, 2016 it has purchased the assets of Conductive Compound Inc of Hudson, New Hampshire.
21 Sep 2016
Hendor PE UK and A-Gas EM have agreed to jointly promote the full product range offered by Hendor PE.
21 Sep 2016
Steve Hirst of A-Gas Electronic Materials assisted his customer PW Circuits in installing the Dow electroless copper chemistry (Circuposit 3000-1).
21 Sep 2016
Microchem Corp release PermiNex™ 1000 and 2000 Series - photoimageable wafer bonding adhesives
21 Sep 2016