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MACFEST Next Generation of PCB Surface Finish - Webinar

A-Gas Electronic Materials Ltd News and PR from A-Gas Electronic Materials Ltd - Published 18 November 2016 Partly funded by Innovate UK, the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding.
Next Generation of PCB Surface Finish - Webinar

Join us for a webinar on Dec 01, 2016 at 10:30 AM GMT.

MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology. Partly funded by Innovate UK (formerly the Technology Strategy Board), the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding. This will help PCB manufacturers meet the performance demands for high value electronic systems, ensuring long term reliability, even in harsh environmental conditions.

In addition, the use of deep eutectic solvents (DESs), a patented technology of the University of Leicester, offers the ability to significantly reduce the environmental impact of a number of PCB plating technologies, reducing the requirements for use of cyanide and toxic/corrosive acids in plating baths This webinar will provide detailed results from the project, performance testing and practical assembly trials After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides is sent to each delegate after the webinar.

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