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Microchem Corp release PermiNex™ 1000 and 2000 Series

A-Gas Electronic Materials Ltd News and PR from A-Gas Electronic Materials Ltd - Published 21 September 2016 Microchem Corp release PermiNex™ 1000 and 2000 Series - photoimageable wafer bonding adhesives
MicroChem PermiNex™ 1000 and 2000 resists are epoxy based, photo-imageable bonding resists used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.
MicroChem PermiNex™ 1000 and 2000 resists are epoxy based

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