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Tecman to Preview Dual Action Adhesive Technology at Lightweight Vehicle Manufac

Tecman Speciality Materials Ltd News and PR from Tecman Speciality Materials Ltd - Published 08 October 2015 Tecman Speciality Materials Ltd is excited to announce they will be exhibiting at the Lightweight Vehicle Manufacturing: Joining, Forming & Assembly Summit 2015 in Birmingham on 18-19th November 2015.
Tecman will be exclusively previewing their ground breaking DAAT® (dual action adhesive technology). The revolutionary new technology has attracted the attention of the automotive industry due to its potential to transform the way that carbon fibre reinforced plastic (CFRP) panels are manufactured. Sign up to the DAAT project group and be kept up to date on exciting developments, register here.

The congress will be focusing on reducing the costs and complexity of high volume manufacturing processes with the special emphasis on multi material joining, forming and assembly advancements for next generation lightweight vehicles. The Summit will allow the leading experts from OEMs, Tier 1 suppliers and technology providers to converge to one location to discuss the most critical areas within manufacturing and assembly processes to enable delivery of next-generation lightweight materials to the forecourt.

With world class capabilities and innovative, creative thinking, Tecman’s self-adhesive solutions have enhanced applications for over 20 years, recently picking up two awards at the Global Product and Service Awards for Best Adhesive Tape Converter – UK and Best Industrial Adhesive Tape: Bond44.
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The revolutionary new technology has attracted the attention of the automotive industry

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